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Stearinlys stand-light metall konstruksjon med hyller i form av kurver. Hjul med bremser gir mobilitet og enkel omplassering av stativet på butikkens lokaler. Grafikk laget av plast og trykt med kundelogo.
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Stå for tømmerpaneler laget av metall. gir praktisk eksponering av panelene. Stativet for underloggpaneler lar deg optimalisere tilgjengelig plass og utstillinger av mange gulvvarianter.
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With this article and some others that will follow later we would like to share available knowledge in the PCB design and manufacturing field.
Following some articles related to HDI PCBs we would like to describe the three related more common build-up structures.
HDI PCB types
The design designation system of this standard recognizes industry approved design types used in the manufacture of HDI printed boards. The designations determine the HDI design type by defining the number and location of HDI layers that may or may not be combined with a substrate.
Type I, Standard build-up for HDI
This construction describes an HDI in which there are both blind vias and through vias used for interconnection. Type I constructions describe the fabrication of a single blind via layer on either one or both sides of an PCB substrate core.
The PCB substrate is typically manufactured using conventional PCB techniques and laser via hole technology. The substrate can have as few as one circuit layer or may be as complex as any number of inner layers.
Type II, Sequential build-up 1+N+1
Tipe II is characterized by buried vias in the core and may have through vias through the outer layers. Type II constructions describe an HDI board in which there are plated microvias, plated buried vias and may have PTHs used for surface-to-surface interconnection.
Microvias on layer 1 and layer n grant the connection to conductors on layer 2 and layer n-1, making the connection with the core. Type II constructions can also have PTH to connect layer 1 directly to layer n.
Struttura Tipo III, build-up sequenziale X+N+X
Type III constructions describe an HDI in which there are plated microvias, paste/resin filled holes and through vias used for interconnection. Type III constructions are distinguished by having at least two microvia layers on at least one side of a substrate core. The substrate core is usually manufactured using conventional PCB techniques, may be rigid or flexible, and have as few as one or as many as any number of layers with buried vias.
Where space is minimal and if expressly requested, stacked vias - stacked blind holes - must be used - while where conditions allow it, staggered vias - non-overlapping blind holes on several levels - can be used. Staggered vias are less critical, so preferable, for manufacturing than stacked vias.
For more details, call us +39 059 269711 or send an e-mail sales@cistelaier.com
Following some articles related to HDI PCBs we would like to describe the three related more common build-up structures.
HDI PCB types
The design designation system of this standard recognizes industry approved design types used in the manufacture of HDI printed boards. The designations determine the HDI design type by defining the number and location of HDI layers that may or may not be combined with a substrate.
Type I, Standard build-up for HDI
This construction describes an HDI in which there are both blind vias and through vias used for interconnection. Type I constructions describe the fabrication of a single blind via layer on either one or both sides of an PCB substrate core.
The PCB substrate is typically manufactured using conventional PCB techniques and laser via hole technology. The substrate can have as few as one circuit layer or may be as complex as any number of inner layers.
Type II, Sequential build-up 1+N+1
Tipe II is characterized by buried vias in the core and may have through vias through the outer layers. Type II constructions describe an HDI board in which there are plated microvias, plated buried vias and may have PTHs used for surface-to-surface interconnection.
Microvias on layer 1 and layer n grant the connection to conductors on layer 2 and layer n-1, making the connection with the core. Type II constructions can also have PTH to connect layer 1 directly to layer n.
Struttura Tipo III, build-up sequenziale X+N+X
Type III constructions describe an HDI in which there are plated microvias, paste/resin filled holes and through vias used for interconnection. Type III constructions are distinguished by having at least two microvia layers on at least one side of a substrate core. The substrate core is usually manufactured using conventional PCB techniques, may be rigid or flexible, and have as few as one or as many as any number of layers with buried vias.
Where space is minimal and if expressly requested, stacked vias - stacked blind holes - must be used - while where conditions allow it, staggered vias - non-overlapping blind holes on several levels - can be used. Staggered vias are less critical, so preferable, for manufacturing than stacked vias.
For more details, call us +39 059 269711 or send an e-mail sales@cistelaier.com
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In PCB market,
HDI technology required the adoption of
new technical skills, new machineries and the implementation of the related production processes including that of f
illing the through holes and laser holes, necessary for the realization of" filled and capped vias”, technique also known as "plating over filled vias” well described by the IPC 4761 standard as Type VII filling.
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
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Stå for hageverktøy, nødvendig i enhver hagebutikk, industriell. Spadestativet vil perfekt utfylle utstillingene i butikken, i House and Garden-delen. Stabil konstruksjon laget av pulverlakkert metall.
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Metall bokhylle for drinker med 4 etasjer for hengende flasker. kleshengere plassert i Coca-cola drikkestativet gjør det enkelt å fjerne flasker. Denne løsningen lar deg lagre en større mengde av produktet og gjøre det enda mer tilgjengelig for kunder på salgsstedet.
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Torun vodka stativ refererer til en flaske fra 1920-tallet, ble designet og produsert for å øke synligheten av den stilige flasken og understreke den unike eksponeringen på salgsstedet. Solide hyller gjør det mulig å lagre 70 flasker og belyse dem med attraktive produktpresentasjoner. På den opprinnelige måten ble merkevaren presentert, noe som økte anerkjennelsen på markedet.
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Pepper sett med to salongbord, metall pulverlakkert konstruksjon, bordplate med møbelplate. Salongbordene er innredet i minimalistisk stil, ideelt for moderne interiør. Pepper salongbord sett tar ikke opp mye plass, kan du skyve et mindre bord under den andre eller satt opp med to separate
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feb 25 2021
Andre nyheter
HDI technology for high-performance printed circuit boards
Dato: 25. februar 2021 16:08
The global electronics market has been pushing for years towards increasing
miniaturization.
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
keep reading
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
keep reading
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Display på Coca Cole som kombinerer eksponeringer av individuelle produkter, samt muligheten til å lagre flere varer. Rå tre og metall elementer på en original måte understreke de eksponerte produktene.
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Gressmetall blomsterbed på nózki er minimalistisk,solid og tidløs. Hele laget av metall, pulverlakkert med dimensjoner på 500x250x750 Ser imponerende ut på balkongen, terrassen og verandaen. Gressmetall blomsterbed vil fungere bra som et supplement til loft-stil interiør, skandinavisk
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feb 9 2021
Andre nyheter
IMPACT OF MOISTURE ON SOLDERING QUALITY OF ELECTRONIC COMPONENTS ON PCBs
Dato: 9. februar 2021 07:52
In the previous technical article we illustrated
some defects generated on PCBs due to the presence of humidity.
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here
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Oval speil i en metallramme understreke stilen på interiøret. Metallrammen på speilet er et karakteristisk og oppmerksomhetstrekkende element. Oval speil i metallramme vil fungere i alle arrangement. dimensjoner: 100cmx70 cm
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Vinstativet er solid og slitesterkt, laget av metall. Vinstativet har trange hyller som ligner en vinfatform. Forenkler organiseringen av utstillingen av 45 flasker vin
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Et stramt veggspeil. Modellen har en rustfritt stål ramme, flott for bad. De la perfekt vekt på arrangementene av interiøret i skandinavisk, moderne stil. Formen på speilet lar deg komfortabelt bruke produktet. Speil diameter 610mm
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I vårt tilbud finner du ikke bare ferdige produkter, men også tjenester. En av dem er laserskjæring av metall. Ved hjelp av en laserstråle vil vi kutte ut alle former som passer inn i de tekniske egenskapene til våre maskiner. Du vil i utgangspunktet motta et mellomliggende eller ferdig produkt fra oss – avhengig av formålet med produktet. Laserskjæring brukes til behandling av strukturelt stål, rustfritt stål og aluminium.
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Peppper vedstativ - enkel konstruksjon, pulverlakkert. stå for treet lar deg ta med orden i rommet der ligger. Plassert glade i et stativ for ved understreke den moderne karakter av interiøret. Vedstativet er en kombinasjon av etethic og nytte skreddersydd til hver stue med.
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Uavhengig av sesongen av lyspærer vi trenger hver dag Derfor investerer i en multimedia skjerm for presentasjon av lyspærer er alltid en god idé Bruken av interaktive elementer tiltrekker absolutt potensielle kunder, og bakgrunnsbelyste elementer og original form vil interessere alle uten unntak.
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CNC fresing er en av de mest brukte metoder for behandling av metall, plast og tre. Ved hjelp av forskjellige blader kan du få de mest forskjellige former i metall, plast, kryssfiner, tre. Takket være CNC fresing oppnår vi høy presisjon, presise elementer, i henhold til designet. Vi fres størrelse 2750x1500mm.
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